LG enters chip packaging arena with Laser Direct Imaging machine, as TSMC's CoWoS remains constrained — maskless machine is designed to pattern fine interconnects, trading resolution for higher throughput - Tom's Hardware

LG has entered chip packaging with a Laser Direct Imaging machine for fine interconnect patterning that trades resolution for throughput, as TSMC's CoWoS capacity remains constrained.

LG enters chip packaging arena with Laser Direct Imaging machine, as TSMC's CoWoS remains constrained — maskless machine is designed to pattern fine interconnects, trading resolution for higher throughput Tom's Hardware