LG enters chip packaging arena with Laser Direct Imaging machine, as TSMC's CoWoS remains constrained — maskless machine is designed to pattern fine interconnects, trading resolution for higher throughput - Tom's Hardware

LG推出激光直接成像机进入芯片封装领域，用于细密互连图案处理，以分辨率换取更高吞吐量，因为台积电的CoWoS产能仍然紧张。

LG enters chip packaging arena with Laser Direct Imaging machine, as TSMC's CoWoS remains constrained — maskless machine is designed to pattern fine interconnects, trading resolution for higher throughput Tom's Hardware